Ltcc Ceramic Package

A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed.

Ltcc ceramic package. 2 3 low cost multilayer ceramic package for flip chip mmic up to w band. The package structure includes a cavity for the flip chip mmic and improved coplanar feed through to suppress radiation. It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum. Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics.

For htcc a final metal coating e g. Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module. Agcu eutectic or low temperature soldering e g. A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g.

High lead count packages. Ltcc substrate with embedded passive components. Ceramic packages for power electronics. Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic.

Ausn eutectic process steps. Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance. Components for fiber optic connectors. High strength materials ltcc hard.

The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic. Ceramic packages and optical filters for image sensors. Ltcc low temperature co fire ceramics is a multi layer glass ceramic substrate which is co fired with low resistance metal conductors at low firing temperature less than 1000. Ceramic packages for light emitting diodes leds ltcc packages for rf modules.

Ceramic packages for mems sensors. Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available. These fabrication technologies provide unique solutions for high interconnect density compact networks and high. Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages.

Ceramic packages for automotive electronics. Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and. They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices. Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization.